september 2011 doc id 17537 rev 1 1/7 7 STPS3L60-Y automotive power schottky rectifier features negligible switching losses low thermal resistance avalanche capability specified aec q101 qualified ecopack ? 2 compliant component description schottky rectifier suited for switched mode power supplies and high frequency dc to dc converters. packaged in smc this device is intended for use in dc/dc chargers for automotive applications. table 1. device summary i f(av) 3 a v rrm 60 v t j (max) 150 c v f (max) 0.65 v stps3l60sy smc (jedec do-214ab) www.st.com
characteristics STPS3L60-Y 2/7 doc id 17537 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.54 x i f(av) + 0.037x i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 10 a i f(av) average forward current t c = 100 c = 0.5 3a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a i rrm repetitive peak reverse current t p = 2 s square f=1 khz 1a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 1600 w t stg storage temperature range -65 to +175 c t j operating junction temperature range (1) 1. condition to avoid thermal runaway for a diode on its own heatsink -40 to +150 c dv/dt critical rate of rise reverse voltage 10000 v/s table 3. thermal resistances symbol parameter value unit r th (j-l) junction to leads 20 c/w table 4. static electrical characteristics symbol parameter tests condit ions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 55 a t j = 125 c 10 15 ma v f (1) forward voltage drop t j = 25 c i f = 3 a 0.7 v t j = 125 c i f = 3 a 0.56 0.65 t j = 25 c i f = 6 a 0.94 t j = 125 c i f = 6 a 0.67 0.76 dptot dtj --------------- 1 rth j a ? () ------------------------- - <
STPS3L60-Y characteristics doc id 17537 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5 ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 pf(av)(w) t =tp/t tp if(av) (a) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 15 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 if(av)(a) t =tp/t tp rth(j-a)=75c/w rth(j-a)=rth(j-l) tamb(c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to lead versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 2 4 6 8 10 12 14 im(a) t(s) i m t =0.5 tc=25c tc=100c tc=50c 1e-3 1e-2 1e-1 1e+0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 zth(j-l)/rth(j-l) tp(s) t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse
characteristics STPS3L60-Y 4/7 doc id 17537 rev 1 figure 11. thermal resistance junction to ambient versus copper surface under each lead figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 45 50 55 60 1e-3 1e-2 1e-1 1e+0 1e+1 5e+1 ir(ma) vr(v) tc=25c tc=75c tc=100c tc=125c tc=150c tc=50c 1 10 100 10 20 50 100 200 500 c(pf) f=1mhz tj=25c vr(v) figure 9. forward voltage drop versus forward current (low level, maximum values) figure 10. forward voltage drop versus forward current (high level, maximum values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ifm(a) tj=25c tj=125c tj=150c (typical values) vfm(v) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 2 5 10 20 ifm(a) vfm(v) tj=25c tj=125c tj=150c (typical values) 012345 0 20 40 60 80 100 rth(j-a) (c/w) s(cu) (cm2) epoxy printed circuit board fr4, copper thickness = 35 m
STPS3L60-Y package information doc id 17537 rev 1 5/7 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. footprint, dimensions in mm (inches) table 5. smc dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b (1) 1. dimensions b and c apply to plated leads 2.90 3.20 0.114 0.126 c (1) 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 e c l e2 e1 d a1 a2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14
ordering information STPS3L60-Y 6/7 doc id 17537 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps3l60sy s36y smc 0.24 g 2500 tape and reel table 7. document revision history date revision changes 15-sep-2011 1 initial release.
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